Description
The thermal pad is made of thermal silica gel with heat conductivity of 6.0W/Mk, with great thermal conductivity ability.
Our thermal conductive silicone pad is highly compressible, soft and flexible with self-adhesive properties. Great replacement for traditional heat sink compound grease paste.
Universal fit for all kinds of M.2 2280 SSD and M.2 heatsink, including M.2 PCIe NVMe 4.0 SSD, PCIe NVMe 3.0 SSD, and PS5 M.2 PCIe NVMe 4.0 SSD, such as WD Black SN850, Samsung 980 Pro, Samsung 970 Pro, Silicon Power US70, and etc.
Suitable for computer host, laptop, control board, motor, electronics, CPU, GPU, heat sink, power LED, auto mechanics, DVD, VCD, LID, Set-top box, LED IC and any cooling modules.
Note: Please remove the protective films on both sides of the thermal pad before using.
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